The report comprises a detailed analysis of the vital elements of the Next Generation Integrated Circuit market, including key drivers, constraints, opportunities, limitations, threats, and micro- and macro-economic factors. The report carefully investigates the present market scenario and the fundamental growth prospects. The report entails an organized database of the Next Generation Integrated Circuit market dynamics that helps market analysts estimate the global market growth rate over the projected timeline.
The next generation integrated circuit is a type of integrated circuit made of advanced materials and components, to improve energy efficiency, convenience, security features, and functionalities. Very-large scale integration, for example, reduces the size of circuits, increases cost-effectiveness of devices, and improves performance in terms of circuit operating speed. These benefits increase the reliability of next-generation integrated circuits and make them an ideal component for a variety of electronic appliances.
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The report offers a complete analysis of the global Next Generation Integrated Circuit market with details about each market player including company profile, financial standing, global position, revenue contribution, production and manufacturing capacity, business expansion plans, and new product launches. Key players are strategizing various plans such as MA acquisition, partnerships, joint ventures, license agreement and collaborations. Allied Electronics Automation, DERF Electronics Corp., Mouser Electronics, Inc., Infineon Technologies AG, Skyworks Solutions, Inc., Analog Devices, Inc., Achronix Semiconductor Corporation, Bourns, Inc., Macronix International Co., Ltd., and TDK-Micronas GmbH. and others are some of the top companies profiled in the report.
Some Key Highlights in the Report:
- In January 2022, Navitas Semiconductor, the industry leader in Gallium Nitride (GaN) power integrated circuits, announced the establishment of a new electric vehicle design center as part of its continued expansion into higher power GaN market. Compared to legacy silicon solutions, GaN-based onboard chargers are expected to charge three times faster and save up to 70% of energy.
- Mixed-signal integrated circuit segment accounted for a significantly large revenue share in 2020. Majority of industries acknowledge the benefits of using mixed-signal integrated circuits, which help in improving reliability, lowering initial costs, and reducing power usage. This has resulted in high preference for mixed-signal integrated circuits among end-use industries, which is expected to drive revenue growth of this segment.
- Surface mount packaging segment accounted for a significantly large revenue share in 2020, due to greater preference for surface mount packaging and advantages provided by it, such as reduced component size, increased component density, and improved mechanical performance under shock and vibration conditions. Furthermore, lower initial cost, as well as simple and quick automated assembly, make it a popular choice among end users.
The report also covers the scope of individual applications and types in each region. The report also covers details about production and consumption patterns, technological developments, revenue growth, market size, market share, key trends and demands influencing market growth in the region, and robust presence of key players in the region.
Next Generation Integrated Circuit Market segmentation
Emergen Research has segmented the global next generation integrated circuit market on the basis of product type, technique, number of components, package, application, and region:
- Product Type Outlook (Revenue, USD Million; 2018–2030)
- Digital Integrated Circuit
- Analog Integrated Circuit
- Mixed-Signal Integrated Circuit
- Technique Outlook (Revenue, USD Million; 2018–2030)
- Thin and Thick Film Integrated Circuit
- Monolithic Integrated Circuit
- Hybrid or multichip Integrated Circuit
- Number of Components Outlook (Revenue, USD Million; 2018–2030)
- Small-scale Integration
- Medium-scale Integration
- Large-scale Integration
- Very Large-scale Integration
- Ultra Large-scale Integration
- Package Outlook (Revenue, USD Million; 2018–2030)
- Through-Hole Mount Packages
- Surface Mount Packaging
- Application Outlook (Revenue, USD Million; 2018–2030)
- Consumer Electronics
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Key point summary of the report:
- The report offers a comprehensive overview of the market size, share, and growth rate in the forecast duration.
- It provides details about current scenario, historical data, giving an accurate market forecast for the coming years.
- The study categorizes the market on the basis of product types, applications, end users, market value and volume, business verticals, and 5 major regions.
- It also offers regional market analysis and forecast for prominent geographies in the sector viz., North America, Europe, Asia Pacific, Latin America, and the Middle East and Africa.
- Industry supply chain, sourcing strategy, upstream feedstock, and downstream demand analysis has also been undertaken in the research report.
- The study offers a comprehensive understanding of the demand and supply dynamics, including production and consumption rates, and mapping of the overall market.
- The report employs different analytical tools including, SWOT analysis, Porter’s five forces analysis, and pricing analysis, to give precise market information.
Regional segmentation comprises of a current and forecast estimation of the market in the key geographical regions such as North America, Europe, Asia Pacific, Latin America, and Middle East Africa.
Regional Outlook of Next Generation Integrated Circuit Market:
- North America
- Rest of Europe
- Asia Pacific
- South Korea
- Rest of APAC
- Latin America
- Rest of LATAM
- Middle East Africa
- Saudi Arabia
- South Africa
- Rest of MEA
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